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ADVANCED ELECTRONIC SOLUTIONS
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Solder Paste
Processes
Assembly Cleaning
Automated Optical Inspection
BGA/Device Underfill
Bonding/Coating
Circuit Card Assembly
Component Placement
Material Dispensing
Pin Thru Hole Assembly
Reflow Soldering
Secondary Assembly
Solder Paste
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Specialized Rework
X-Ray Inspection
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Solder Paste
Solder Paste Application
Teledyne EMS custom designs stencils for the specific application and customer requirement
Paste application is controlled using automated vision-aligned stencil printers
3D Solder Paste Inspection
Teledyne EMS inspects 100% of solder paste deposits using automated Solder Paste Inspection systems
Each solder deposit is measured for coverage, height, and volume to ensure the proper amount of solder for each solder joint created in the SMT process
The Solder Paste Inspection system retains inspection data for each deposit location such as SPC, analysis, and other key locations
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